Heat sink compound (Aka Thermal grease, thermal paste, and thermal ). Use this whenever you’re connecting a component to a heat sink, it’ll really help to dissipate even more potentially damaging heat. This HY500 series thermal grease offer better cooling performance with high thermal conductivity graphite and powder. This thermal grease should be used to fill the gaps and expanding cooling area between the component and the heat sink.
It has a thermal conductivity of 1.172 W/(mK), which should be plenty for voltage regulators, MOSFETs, motor drivers, audio amplifiers, etc.
Features
Color: Grey
Weight: (N.W) (as the picture)
Thermal conductivity > 1.172 W/m-k
Thermal Impedance <0.225
Specific Gravity >2.0
Viscosity 1000
Thixotropic Index 380+_10
Viscosity -50~300
Operation Temperature -30~300
Silicone Compounds 50%
Carbon Compounds 30%
Metal Oxide Compounds 20%
Graphite Thermal Grease, thermal Conductivity 1.93W/m-k~2.15W/m-k
Good Electric Insulating, Breakdown 10Kv voltage
Low Thermal Impedance, Keep grease condition with long time
With a wide range working temperature, keep stable performance at temperature -30~300 High performance
Applications:
Cooling device to the end plate heat sink
High speed and large storage Drives
Automotive Engine controls
Hard disk drive and DVD drives
Power conversion apparatus
High Power LEDs
Notebook and desktop computers
Network Communication Equipment
Household appliances, electronic components, electrical
₹ 23.00
₹ 399
₹ 7.00
₹ 99
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Total Weight
0.00 KG.